GENEVA, Aug. 7 -- RESONAC CORPORATION filed a patent application (JP2025/002805) for “BONDED MAGNET AND COMPOUND”. With publication no. WO/2026/163309, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01F 1/059
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....