INTERNATIONAL PATENT: BOE TECHNOLOGY GROUP CO., LTD., 京东方科技集团股份有限公司, HEFEI BOE PIXEY TECHNOLOGY CO., LTD., 合肥京东方星宇科技有限公司 FILES APPLICATION FOR "ASSEMBLING DEVICE AND CONTROL METHOD THEREFOR AND DIE BONDING SYSTEM"

Posted On: 2025-07-07

GENEVA, July 7 -- BOE TECHNOLOGY GROUP CO., LTD. (No.10 Jiuxianqiao Rd.,Chaoyang District, Beijing 100015), 京东方科技集团股份有限公司 (中国北京市朝阳区酒仙桥路10号), HEFEI BOE PIXEY TECHNOLOGY CO., LTD. (No.668 Longzihu Road, Xinzhan District,Hefei, Anhui 230012), 合肥京东方星宇科技有限公司 (中国安徽省合肥市新站区龙子湖路668号) filed a patent application (PCT/CN2024/133949) for "ASSEMBLING DEVICE AND CONTROL METHOD ...

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INTERNATIONAL PATENT: BOE TECHNOLOGY GROUP CO., LTD., 京东方科技集团股份有限公司, HEFEI BOE PIXEY TECHNOLOGY CO., LTD., 合肥京东方星宇科技有限公司 FILES APPLICATION FOR "ASSEMBLING DEVICE AND CONTROL METHOD THEREFOR AND DIE BONDING SYSTEM"