International Patent: BOARD LAYOUT STRUCTURE FOR IMPROVING ISOLATION BETWEEN TRACES, AND CIRCUIT BOARD

GENEVA, Sept. 24 -- LANSUS TECHNOLOGIES INC. filed a patent application (CN2026/081230) for “BOARD LAYOUT STRUCTURE FOR IMPROVING ISOLATION BETWEEN TRACES, AND CIRCUIT BOARD”. With publication no. WO/2026/194646, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/02

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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