GENEVA, July 1 -- QUALCOMM INCORPORATED filed a patent application (CN2024/138711) for “BLOCK DIAGONAL UCD FOR FLEXIBLE LAYER COMBINATION”. With publication no. WO/2026/123288, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H04B 7/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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