International Patent: BIT-LEVEL INTERLEAVING WITHIN CODE BLOCKS USING MULTIPLE MODULATION ORDERS ACROSS LAYERS

GENEVA, Aug. 31 -- QUALCOMM INCORPORATED filed a patent application (CN2025/078419) for “BIT-LEVEL INTERLEAVING WITHIN CODE BLOCKS USING MULTIPLE MODULATION ORDERS ACROSS LAYERS”. With publication no. WO/2026/174514, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H04L 1/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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