INTERNATIONAL PATENT: BIOSMART CORPORATION, (주) 바이오스마트 FILES APPLICATION FOR "BENDING REINFORCING METAL CARD AND MANUFACTURING METHOD THEREOF"

GENEVA, Jan. 27 -- BIOSMART CORPORATION (172, Gwangnaru-ro,Seongdong-gu,Seoul 04791), (주) 바이오스마트 (서울특별시성동구광나루로 172) filed a patent application (PCT/KR2025/009330) for "BENDING REINFORCING METAL CARD AND MANUFACTURING METHOD THEREOF" on Jul 01, 2025. With publication no. WO/2026/019111, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YOON, Tae Ki (102-1204-ho, 54, Dagamal 2-gil,Dongnam-gu, Ch...