GENEVA, July 18 -- MASSACHUSETTS INSTITUTE OF TECHNOLOGY filed a patent application (US2025/018597) for “BIOADHESIVE PACING LEAD”. With publication no. WO/2025/188913, here are the other details related to the patent application:
Kind: Corrected version of pamphlet [A9]
IPC: A61L 31/14
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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