INTERNATIONAL PATENT: BASF SE FILES APPLICATION FOR "USE OF A COMPOSITION OR THERMOSETTING RESIN OR THERMOSET POLYMER MADE THEREFROM AS BUILD-UP FILM MATERIAL IN A PRINTED CIRCUIT ELEMENT"

GENEVA, Nov. 3 -- BASF SE (Carl-Bosch-StraBe 3867056 Ludwigshafen am Rhein) filed a patent application (PCT/EP2025/060932) for "USE OF A COMPOSITION OR THERMOSETTING RESIN OR THERMOSET POLYMER MADE THEREFROM AS BUILD-UP FILM MATERIAL IN A PRINTED CIRCUIT ELEMENT" on Apr 22, 2025. With publication no. WO/2025/224106, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PAWAR, Madhura Shreekar (Carl-Bosch-StraBe 3867056 Ludwigshafen am Rhein), VAIDYANATHAN, Subramanian (Carl-Bosch-StraBe 3867056 Ludwigshafen am Rhein), SCHERR, G...