INTERNATIONAL PATENT: BASF SE FILES APPLICATION FOR "COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR DEFECT-FREE FILLING OF FEATURES ON ELECTRONIC SUBSTRATES"

GENEVA, Feb. 23 -- BASF SE (Carl-Bosch-Strasse 3867056 Ludwigshafen am Rhein) filed a patent application (PCT/EP2025/072930) for "COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR DEFECT-FREE FILLING OF FEATURES ON ELECTRONIC SUBSTRATES" on Aug 08, 2025. With publication no. WO/2026/037751, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HAAG, Alexandra (Carl-Bosch-StraBe 3867056 Ludwigshafen am Rhein), ARNOLD, Marco (Carl-Bosch-StraBe 3867056 Ludwigshafen am Rhein), ENGELHARDT, Nadine (Carl-Bosch-StraBe 386...