GENEVA, July 1 -- TOYO SEIKAN GROUP HOLDINGS, LTD. filed a patent application (JP2025/042101) for “BASE MATERIAL FOR MOUNTING ELECTRONIC DEVICE AND ROLL-SHAPED PACKAGE OF SAME”. With publication no. WO/2026/126889, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B32B 15/08
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....