GENEVA, June 26 -- SHENZHEN ZHUOJIAN INTELLIGENT MANUFACTURING CO., LTD. filed a patent application (CN2025/121490) for “BALL GRID ARRAY PACKAGED CHIP HAVING REINFORCING SOLDER BALLS, AND ELECTRICAL DEVICE AND MOBILE PLATFORM”. With publication no. WO/2026/118618, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 23/498
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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