INTERNATIONAL PATENT: AVIENT CORPORATION FILES APPLICATION FOR "POLYMERIC SUBSTRATE FOR ELECTROPLATING AND METHODS OF PREPARATION OF THE SAME"

GENEVA, Sept. 22 -- AVIENT CORPORATION (Legal Department-IP33587 Walker RoadAvon Lake, Ohio 44012) filed a patent application (PCT/US2025/019883) for "POLYMERIC SUBSTRATE FOR ELECTROPLATING AND METHODS OF PREPARATION OF THE SAME" on Mar 14, 2025. With publication no. WO/2025/194012, the details related to the patent application was published on Sep 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOHM, Kerstin (c/o Avient CorporationLegal Dept - IP33587 Walker RoadAvon Lake, Ohio 44012), ALBAS, Carlos (c/o Avient CorporationLegal Dept - IP33587 Walker RoadAvon Lake, Ohio 44012), ARINO, El...