International Patent: ASSEMBLY MODULE, MOUNTING PART, AND CONNECTING PART CAPABLE OF OMNIDIRECTIONAL COUPLING WITHOUT INTERFERENCE

GENEVA, July 27 -- LEE, Sang-Cheol filed a patent application (KR2026/001077) for “ASSEMBLY MODULE, MOUNTING PART, AND CONNECTING PART CAPABLE OF OMNIDIRECTIONAL COUPLING WITHOUT INTERFERENCE”. With publication no. WO/2026/155614, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: A63H 33/08

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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