GENEVA, Aug. 7 -- SAFRAN ELECTRONICS & DEFENSE filed a patent application (EP2026/052807) for “ASSEMBLY BY METAL SINTERING WITH CONTROL OF THE CHIP HEIGHT IN ORDER TO CONTROL FLATNESS AND ATTITUDE”. With publication no. WO/2026/162846, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B81C 3/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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