INTERNATIONAL PATENT: ASML NETHERLANDS B.V. FILES APPLICATION FOR "WAFER-TO-WAFER BONDING PROCESS"

GENEVA, Dec. 29 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/063754) for "WAFER-TO-WAFER BONDING PROCESS" on May 20, 2025. With publication no. WO/2025/261690, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YILDIRIM, Oktay (P.O. Box 3245500 AH Veldhoven), VAN HAREN, Richard, Johannes, Franciscus (P.O. Box 3245500 AH Veldhoven), PETROV, Andrei Yevgenyevich (P.O. Box 3245500 AH Veldhoven), VAN DIJK, Leon, Paul (P.O. Box 3245500 AH Veldhoven), VAN HAL, Paulus, Albertus (P.O...