GENEVA, March 16 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/072735) for "METHOD AND APPARATUS FOR MONITORING SUBSTRATE BONDING" on Aug 07, 2025. With publication no. WO/2026/052326, the details related to the patent application was published on Mar 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BUIJS, Robin, Daniel (P.O. Box 3245500 AH Veldhoven), BROERS, Sander, Christiaan (P.O. Box 3245500 AH Veldhoven), DE JAGER, Pieter, Willem, Herman (P.O. Box 3245500 AH Veldhoven)
Abstract: There is provided a substrate bonding apparatus compri...