GENEVA, Dec. 29 -- ASML NETHERLANDS B.V. (P.O. Box 3245500 AH Veldhoven) filed a patent application (PCT/EP2025/063931) for "METHOD AND APPARATUS FOR BONDING SUBSTRATES" on May 21, 2025. With publication no. WO/2025/261694, the details related to the patent application was published on Dec 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TSENG, Yun-Heng (P.O. Box 3245500 AH Veldhoven), HSU, Chia-Hao (P.O. Box 3245500 AH Veldhoven)
Abstract: Disclosed is a substrate bonding apparatus, comprising: a first clamp for securely holding a first substrate comprising a first bonding surface; and ...