INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "SYSTEMS AND METHODS FOR FORMING THERMAL INTERFACE MATERIAL ON SUBSTRATES"

GENEVA, Jan. 20 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/024960) for "SYSTEMS AND METHODS FOR FORMING THERMAL INTERFACE MATERIAL ON SUBSTRATES" on Apr 16, 2025. With publication no. WO/2026/015183, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WONG, Keith-Kwong-Hon (Applied MaterialsNanoFab X Suite 448Albany, New York 12203), LI, Kun (141 Fuller RoadNFX dockAlbny, New York 12203), APPELL, Jason (141 Fuller Road NFX DockAlbany, New York 12203), KN...