INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "SUBSTRATE PROCESSING INCLUDING INITIAL ETCHING AND FAST ETCHING AND RELATED METHODS, APPARATUS, SYSTEMS AND CHAMBERS"

GENEVA, March 3 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/041130) for "SUBSTRATE PROCESSING INCLUDING INITIAL ETCHING AND FAST ETCHING, AND RELATED METHODS, APPARATUS, SYSTEMS, AND CHAMBERS" on Aug 07, 2025. With publication no. WO/2026/043656, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUANG, Yi-Chiau (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054), CHOPRA, Saurabh (c/o Applied Materials, Inc.,...