INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "SUBSTRATE CHUCKING WITH MULTISCALE WAFER STRESS MODULATION"

GENEVA, March 24 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/044943) for "SUBSTRATE CHUCKING WITH MULTISCALE WAFER STRESS MODULATION" on Sep 04, 2025. With publication no. WO/2026/059801, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUBRAHMANYAN, Pradeep Kumar (3050 Bowers AvenueSanta Clara, California 95054), LEE, Wonjae (3050 Bowers AvenueSanta Clara, California 95054)

Abstract: Disclosed systems and techniques are directed to improving chucking...