INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "LOW COST ELECTROSTATIC CHUCK FOR CHUCKING INSULATOR SUBSTRATES"

GENEVA, Sept. 22 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/019769) for "LOW COST ELECTROSTATIC CHUCK FOR CHUCKING INSULATOR SUBSTRATES" on Mar 13, 2025. With publication no. WO/2025/193942, the details related to the patent application was published on Sep 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PARKHE, Vijay D. (4054 Bouquet Park LaneSan Jose, California 95135)

Abstract: Methods of forming electrostatic chucks (ESCs) are provided herein. In some embodiments, a method of forming an electrostatic chuck (E...