INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "HIGH BANDWIDTH DENSITY OPTICAL INTERFACES FOR CO-PACKAGED DEVICES INCLUDING PHOTONIC INTEGRATED CIRCUITS"

GENEVA, May 6 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, CA 95054) filed a patent application (PCT/US2025/051748) for "HIGH BANDWIDTH DENSITY OPTICAL INTERFACES FOR CO-PACKAGED DEVICES INCLUDING PHOTONIC INTEGRATED CIRCUITS" on Oct 20, 2025. With publication no. WO/2026/090093, the details related to the patent application was published on Apr 30, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DOSUNMU, Olufemi, I. (3050 Bowers AvenueSanta Clara, CA 95054), BLUM, Robert (3050 Bowers AvenueSanta Clara, CA 95054), YANG, Zijiao (3050 Bowers AvenueSanta Clara, CA 95054), FU, Jinx...