INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "DUMMY FEATURES FOR DISSIPATING HEAT IN PACKAGES INCLUDING ADVANCED SEMICONDUCTOR CHIPS"

GENEVA, Dec. 2 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/027321) for "DUMMY FEATURES FOR DISSIPATING HEAT IN PACKAGES INCLUDING ADVANCED SEMICONDUCTOR CHIPS" on May 01, 2025. With publication no. WO/2025/244809, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JINHO, An (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSanta Clara, California 95054), SEE, Guan Huei (c/o Applied Materials, Inc., Law Dept., M/S 12693050 Bowers AvenueSa...