INTERNATIONAL PATENT: APPLIED MATERIALS, INC. FILES APPLICATION FOR "ALUMINUM NITRIDE BONDING LAYER"

GENEVA, March 3 -- APPLIED MATERIALS, INC. (3050 Bowers AvenueSanta Clara, California 95054) filed a patent application (PCT/US2025/042397) for "ALUMINUM NITRIDE BONDING LAYER" on Aug 18, 2025. With publication no. WO/2026/043792, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JEON, Yoocharn (3333 Scott Blvd.Santa Clara, California 95054), EL KHOURY MAROUN, Michel (3333 Scott BlvdB52, 3rd FloorSanta Clara, California 95054)

Abstract: Methods and structures relating to bonding wafers using an aluminum nitride bonding lay...