International Patent: APPLICATION CLONING METHOD, ELECTRONIC DEVICE, STORAGE MEDIUM, AND CHIP SYSTEM

GENEVA, June 19 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/116290) for “APPLICATION CLONING METHOD, ELECTRONIC DEVICE, STORAGE MEDIUM, AND CHIP SYSTEM”. With publication no. WO/2026/061210, here are the other details related to the patent application:

Kind: Corrected version of pamphlet [A9]

IPC: G06F 8/61

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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