International Patent: APPARATUSES AND METHODS FOR ETCHING PROCESS

GENEVA, June 26 -- TOKYO ELECTRON LIMITED filed a patent application (US2025/051059) for “APPARATUSES AND METHODS FOR ETCHING PROCESS”. With publication no. WO/2026/122196, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10P 50/61

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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