GENEVA, July 27 -- BOYA ADVANCED MATERIALS CO., LTD. filed a patent application (CN2025/072884) for “APPARATUS AND METHOD FOR SEPARATING WAFERS, AND STORAGE MEDIUM”. With publication no. WO/2026/152351, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/67
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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