GENEVA, Sept. 18 -- HBL CORPORATION filed a patent application (KR2025/008834) for “APPARATUS AND METHOD FOR EVALUATING WELDING INTEGRITY”. With publication no. WO/2026/186960, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01N 25/72
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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