GENEVA, Dec. 22 -- APIC YAMADA CORPORATION (90, Ooaza Kamitokuma, Chikuma-shi, Nagano3890898), アピックヤマダ株式会社 (長野県千曲市大字上徳間９０番地) filed a patent application (PCT/JP2025/016718) for "SEALING MOLD, RESIN SEALING DEVICE, AND RESIN SEALING METHOD" on May 07, 2025. With publication no. WO/2025/258271, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SAIT...