INTERNATIONAL PATENT: AP INFOSENSE LIMITED FILES APPLICATION FOR "HIGH RESOLUTION PHOTONIC CHIP INTEGRATED HANDHELD MINIATURE 3D NON-DESTRUCTIVE IMAGING SYSTEM"

GENEVA, Nov. 3 -- AP INFOSENSE LIMITED (Unit 317, 3/F., Building 8W Phase Two, Hong Kong Science Park, Pak Shek Kok, New TerritoriesHong Kong) filed a patent application (PCT/IB2024/053976) for "HIGH RESOLUTION PHOTONIC CHIP INTEGRATED HANDHELD MINIATURE 3D NON-DESTRUCTIVE IMAGING SYSTEM" on Apr 24, 2024. With publication no. WO/2025/224483, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAU, Kam Chiu (15000 Johns Hopkins DriveRockville, Maryland 20850), CHAN, Po Shan (Unit 317, 3/F., Building 8W Phase Two, Hong Kong Sci...