International Patent: AN ATOMIC LAYER PROCESS PRINTER FOR MATERIAL DEPOSITION, ETCHING, DOPING AND/OR CLEANING AND A PRINTER HEAD ARRANGEMENT FOR ENABLING PRINTING

GENEVA, Sept. 7 -- ATLANT 3D APS filed a patent application (EP2026/055134) for “AN ATOMIC LAYER PROCESS PRINTER FOR MATERIAL DEPOSITION, ETCHING, DOPING AND/OR CLEANING AND A PRINTER HEAD ARRANGEMENT FOR ENABLING PRINTING”. With publication no. WO/2026/180515, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C23C 16/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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