INTERNATIONAL PATENT: AJINOMOTO CO., INC., 味の素株式会社 FILES APPLICATION FOR "METHOD FOR MANUFACTURING CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE"

GENEVA, Feb. 3 -- AJINOMOTO CO., INC. (15-1, Kyobashi 1-chome, Chuo-ku, Tokyo1048315), 味の素株式会社 (東京都中央区京橋一丁目１５番１号) filed a patent application (PCT/JP2025/025727) for "METHOD FOR MANUFACTURING CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE" on Jul 18, 2025. With publication no. WO/2026/023566, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): OKAZAKI, Daichi (c/o Ajinomoto F...