GENEVA, Sept. 24 -- DYSON TECHNOLOGY LIMITED filed a patent application (IB2026/052374) for “AIRFLOW ASSEMBLY”. With publication no. WO/2026/196109, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: F04D 25/08
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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