INTERNATIONAL PATENT: ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "MODULARIZED CONSTRUCT FOR COMPLEX MULTI-DIE INTEGRATION PACKAGE"

GENEVA, Jan. 13 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2025/033362) for "MODULARIZED CONSTRUCT FOR COMPLEX MULTI-DIE INTEGRATION PACKAGE" on Jun 12, 2025. With publication no. WO/2026/010718, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NG, Kong Toon (No. 101 Sec. 2, Gogdao 5th RoadEast Dist.Hsinchu, 30070)

Abstract: Modularized construction of a structure is used for a multi-die integration package. Segregation of complex devices into subs...