INTERNATIONAL PATENT: ADVANCED MICRO DEVICES, INC. FILES APPLICATION FOR "INTEGRATED CIRCUIT DIE STACK WITH A BACK-SIDE POWER DELIVERY NETWORK"

GENEVA, April 8 -- ADVANCED MICRO DEVICES, INC. (2485 Augustine DriveSanta Clara, California 95054) filed a patent application (PCT/US2025/042214) for "INTEGRATED CIRCUIT DIE STACK WITH A BACK-SIDE POWER DELIVERY NETWORK" on Aug 15, 2025. With publication no. WO/2026/072175, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KULKARNI, Deepak Vasant (7171 Southwest PkwyAustin, Texas 78735), WANG, Liwei (7171 Southwest PkwyAustin, Texas 78735), SWAMINATHAN, Raja (7171 Southwest PkwyAustin, Texas 78735), SMITH, Alan D. (7171 So...