GENEVA, Sept. 24 -- EBARA CORPORATION filed a patent application (JP2026/010615) for “ADJUSTMENT METHOD AND PROGRAM FOR FILM THICKNESS MEASURING DEVICE”. With publication no. WO/2026/197351, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01B 11/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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