GENEVA, Sept. 7 -- LINTEC CORPORATION filed a patent application (JP2026/006873) for “ADHESIVE FOR HIGH-FREQUENCY HEATING, STRUCTURE, AND ADHESION METHOD”. With publication no. WO/2026/182068, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 201/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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