GENEVA, Sept. 18 -- RESONAC CORPORATION filed a patent application (JP2026/008283) for “ADHESIVE FILM WITH SUPPORT AND METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE”. With publication no. WO/2026/186816, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 7/30
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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