International Patent: ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMATION MEMBER

GENEVA, June 26 -- RESONAC CORPORATION filed a patent application (JP2025/041659) for “ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMATION MEMBER”. With publication no. WO/2026/121160, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09J 7/30

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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