GENEVA, Oct. 9 -- NITTO DENKO CORPORATION filed a patent application (JP2026/014185) for “ADHESIVE AGENT COMPOSITION FOR ELECTRIC DEBONDING, ELECTRIC DEBONDING TYPE ADHESIVE SHEET, AND BONDED BODY”. With publication no. WO/2026/212010, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 9/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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