INTERNATIONAL PATENT: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. FILES APPLICATION FOR "STRUCTURES AND METHODS FOR THERMAL DISSIPATION IN DIES"

GENEVA, Feb. 11 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3025 Orchard ParkwaySan Jose, California 95134) filed a patent application (PCT/US2025/039135) for "STRUCTURES AND METHODS FOR THERMAL DISSIPATION IN DIES" on Jul 24, 2025. With publication no. WO/2026/030123, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KATKAR, Rajesh (3025 Orchard ParkwaySan Jose, California 95134), MIRKARIMI, Laura, Wills (3025 Orchard ParkwaySan Jose, California 95134), FOUNTAIN, Gaius, Gillman, Jr. (3025 Orchard ParkwaySan Jose, Cal...