GENEVA, Sept. 7 -- NEXPERIA B.V. filed a patent application (EP2026/055526) for “A SYSTEM FOR TRANSFERRING ELECTRONIC COMPONENTS FROM A WAFER TO A FLEXIBLE SUBSTRATE AS WELL AS A BONDING MODULE FOR USE IN SUCH SYSTEM”. With publication no. WO/2026/180726, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 3/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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