GENEVA, July 6 -- NEXPERIA B.V. filed a patent application (EP2025/089045) for “A SEMICONDUCTOR PACKAGE, A SEMICONDUCTOR DIE, AND METHODS OF MANUFACTURING.”. With publication no. WO/2026/139637, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 72/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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