International Patent: A SEMICONDUCTOR PACKAGE, A HEATSINK, AND METHODS OF MANUFACTURING THEM

GENEVA, July 6 -- NEXPERIA B.V. filed a patent application (EP2025/089044) for “A SEMICONDUCTOR PACKAGE, A HEATSINK, AND METHODS OF MANUFACTURING THEM”. With publication no. WO/2026/139636, here are the other details related to the patent application:

Kind: Initial Publication without ISR [A2]

IPC: H10W 40/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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