GENEVA, July 9 -- SIKA TECHNOLOGY AG filed a patent application (EP2025/084746) for “A POLYMER MATERIAL FOR USE IN A 3D PRINTING PROCESS”. With publication no. WO/2026/145909, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 27/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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