International Patent: A NOVEL KIT OF PARTS FOR DERMAL FILLING

GENEVA, Aug. 7 -- HYAMEDIX APS filed a patent application (EP2026/052015) for “A NOVEL KIT OF PARTS FOR DERMAL FILLING”. With publication no. WO/2026/162487, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: A61L 27/26

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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