GENEVA, July 1 -- NEXPERIA B.V. filed a patent application (EP2025/086974) for “A LEAD FRAME FOR SEMICONDUCTOR PACKAGE, A SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE LEAD FRAME”. With publication no. WO/2026/125769, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 70/40
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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