GENEVA, Sept. 18 -- POLYTECH A/S filed a patent application (EP2026/055408) for “A COMPUTER-IMPLEMENTED METHOD, A NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, AND A SYSTEM FOR CALCULATING TEMPERATURE-COMPENSATED STRAIN”. With publication no. WO/2026/185109, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01B 21/32
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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