International Patent: 3D CHIP PLACEMENT MODEL AND CONSTRUCTION METHOD THEREFOR, AND 3D CHIP PLACEMENT METHOD

GENEVA, June 19 -- PENG CHENG LABORATORY filed a patent application (CN2024/134559) for “3D CHIP PLACEMENT MODEL AND CONSTRUCTION METHOD THEREFOR, AND 3D CHIP PLACEMENT METHOD”. With publication no. WO/2026/102810, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G06F 30/392

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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