GENEVA, Oct. 15 -- RESONAC CORPORATION filed a patent application (JP2026/013883) for “(METH)ACRYLAMIDE COMPOUND, RESIN COMPOSITION, CURED PRODUCT, SHEET, LAMINATE, AND PRINTED WIRING BOARD”. With publication no. WO/2026/216429, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 73/12
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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